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AMD / Xilinx XC7A200T-1FBG484I STOCK

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demandinghigh-performance applications.

General Description:

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demandinghigh-performance applications. 

Summary of 7 Series FPGA Features:

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip databuffering.

• High-performance SelectIO™ technology with support for DDR3interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceiversfrom 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering aspecial low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual12-bit 1MSPS analog-to-digital converters with on-chip thermal andsupply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adderfor high-performance filtering, including optimized symmetriccoefficient filtering.

• Powerful clock management tiles (CMT), combining phase-lockedloop (PLL) and mixed-mode clock manager (MMCM) blocks for highprecision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3Endpoint and Root Port designs.

• Wide variety of configuration options, including support forcommodity memories, 256-bit AES encryption with HMAC/SHA-256authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members inthe same package. All packages available in Pb-free and selectedpackages in Pb option.

• Designed for high performance and lowest power with 28 nm,HKMG, HPL process, 1.0V core voltage process technology and0.9V core voltage option for even lower power.


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