Description：

GigaDevice's 24nm process SLC NAND products, with core capacities of 1Gb, 2Gb, 4Gb, and 8Gb, offer two series: traditional parallel interfaces and the new SPI serial interface. They have been successfully mass-produced. In response to the problems encountered during the operation of NAND Flash, GigaDevice manages, detects and corrects errors by adopting the 8-bit ECC algorithm, providing high performance and security features, and is committed to serving 5G, Internet of Things, network communication, security, and consumer application scenarios including wearable devices. Provide large-capacity solutions with cost advantages.

◆ Supports two supply voltages: 1.8V and 3V

◆ Support random reading of 2K-Byte/4K-Byte Cache space

The programming/erasing cycle reaches 80,000 times, and the data retention time is 10 years

The Parallel NAND interface supports x8 and is compatible with ONFI1.0

The SPI NAND interface supports x1/x2/x4/x4 DTR

◆ SPI NAND additionally supports functions such as Internal ECC, Continuous Read, and Deep Power Down

◆ Supports industrial grade/automotive grade -40℃ to 85℃/-40℃ to 105℃

Performance parameters

Status :MP

Voltage :2.7V to 3.6V

Capacity :1Gb

I/O bus :x1; x2; x4

Frequency :133MHZ

Page size :2KB

ECC requirement :ECC-free

Main feature :DTR

Package :WSON8 8x6mm; WSON8 6x5mm; TFBGA24 8x6mm (5x5 ball array)

Temperature :-40℃ to 85℃ - 40 ℃ ~ 105 ℃