Description：

The GigaDevice GD32F427ZET6 is a versatile member of the GD32F4 series, built around a powerful 200 MHz Arm® Cortex®-M4 core with FPU. It stands out by offering the series' advanced features—including the integrated TFT LCD controller, hardware graphics accelerator (IPA), and rich connectivity—within a space-efficient 144-pin BGA (Ball Grid Array) package. This combination makes it an excellent choice for compact, high-density embedded systems that require robust graphical capabilities and extensive peripheral interfacing, such as advanced industrial controllers, portable medical devices, and networked IoT hubs, where efficient PCB space utilization and signal integrity are critical design factors.

Main Features：

1. Core & Performance

High-Performance Core: 200 MHz Arm® Cortex®-M4 core, integrated with Single-Precision Floating-Point Unit (FPU), supporting DSP instructions.

Dedicated Graphics Accelerator: Built-in IPA (Image Processing Accelerator) hardware graphics accelerator, optimizing 2D graphics operations.

2. Advanced Peripherals & Interfaces

Advanced Display Support: Integrated TFT LCD controller, supporting the driving of RGB interface LCD screens.

Comprehensive Connectivity: Provides 10/100M Ethernet MAC, USB 2.0 OTG FS/HS, dual CAN 2.0B, as well as multiple USART/UART, I2C, and SPI interfaces.

Multimedia & Camera Interface: Built-in hardware JPEG codec and supports Digital Camera Interface (DCI).

High-Speed Analog: Features 3 channels of 12-bit ADC (up to 2.6 MSPS) and 2 channels of 12-bit DAC.

3. Memory, Package & Reliability

Memory Configuration: According to naming conventions, the "E" suffix typically corresponds to a memory configuration of 512KB Flash and 256KB SRAM, providing ample code and data space.

Ball Grid Array Package (Key Differentiator): The "Z" in the model number indicates the use of a 144-pin BGA package. The advantages of the BGA package include a smaller physical size for the same pin count and lower lead inductance, which is beneficial for high-frequency signal integrity. Its challenges lie in requiring more specialized processes for soldering and rework, and PCB designs typically necessitate multi-layer boards.

Consumer/Industrial-Grade Reliability: The suffix "T6" indicates an operating temperature range of -40°C to +85°C.

Typical Applications：

Its BGA package characteristics give it an advantage in the following fields that have special requirements for space and electrical performance:

High-Density Industrial Control Boards: Motion control cards, data acquisition cards, machine vision processing modules that need to integrate a large number of components within a limited area.

Compact Networking & Communication Devices: Miniaturized industrial IoT gateways, protocol converters, edge computing units.

Portable High-End Devices: Handheld medical diagnostic instruments, field testing instruments, core flight controllers for high-end drones.

Consumer Electronics Core Boards: Core Boards or System on Modules (SOM) that require integrating powerful computing and rich interfaces into an extremely small form factor.