Description：

The GigaDevice GD32F427ZGT6 is a high-integration variant within the GD32F4 series, featuring the powerful 200 MHz Arm® Cortex®-M4 core with FPU. It is distinguished by its combination of a space-saving 144-pin BGA package and an enhanced 1024KB (1MB) Flash memory. This model delivers the series' hallmark capabilities—including the integrated TFT LCD controller and hardware graphics accelerator (IPA)—in a compact footprint, making it an optimal choice for embedded systems that demand substantial code storage, advanced graphical processing, and high-density PCB layout, such as sophisticated portable industrial terminals, networked smart devices, and compact automation controllers.

Main Features：

1. Core & Performance

High-Performance Core: 200 MHz Arm® Cortex®-M4 core, integrated with Single-Precision Floating-Point Unit (FPU), supporting DSP instructions.

Dedicated Graphics Accelerator: Built-in IPA (Image Processing Accelerator) hardware graphics accelerator, effectively accelerating 2D graphics processing.

2. Advanced Peripherals & Interfaces

Advanced Display Support: Integrated TFT LCD controller, capable of directly driving RGB interface LCD screens.

Rich Connectivity: Provides 10/100M Ethernet MAC, USB 2.0 OTG FS/HS, dual CAN 2.0B, as well as multiple USART, I2C, and SPI interfaces.

Multimedia Support: Built-in hardware JPEG codec and supports Digital Camera Interface (DCI), facilitating image processing.

High-Speed Analog: Features 3 channels of 12-bit ADC (up to 2.6 MSPS) and 2 channels of 12-bit DAC.

3. Memory, Package & Reliability

Large-Capacity Memory Configuration (Key Differentiator): The "G" in the model number represents that it is equipped with 1024KB (1MB) Flash and 256KB SRAM. This doubles the capacity compared to the "E" version (512KB Flash) in the same BGA package, providing ample space for more complex graphical interfaces, network protocol stacks, and business logic.

Ball Grid Array Package: The "Z" in the model number indicates the use of a 144-pin BGA package. This package accommodates a large number of pins in a limited area, which is beneficial for designing compact products but requires higher PCB design (e.g., multi-layer boards) and soldering processes.

Industrial-Grade Reliability: The suffix "T6" indicates an operating temperature range of -40°C to +85°C.

Typical Applications：

The combination of "1MB Flash + BGA Package" makes it highly suitable for applications with stringent requirements for both code space and product volume:

Compact High-Performance HMI Devices: Feature-rich handheld industrial scanning terminals, portable diagnostic equipment displays, smart interactive panels.

High-End Consumer Electronics Core Boards: High-end smart hardware core modules or System on Modules (SoM) that require powerful processing capabilities and graphical interfaces with extremely small PCB space.

Space-Constrained Networking Devices: Miniaturized industrial IoT gateways, protocol converters that need to implement complex network functions within a limited board area.

Integrated Motion Control Units: Multi-axis compact motion controllers, main control boards for small robots, which require ensuring main control performance while integrating a large number of peripheral circuits such as motor drivers.