Description:

The GigaDevice GD32A711AVT3TB is a versatile and high-performance member of the GD32A7 dual-core microcontroller series. It integrates a 200 MHz Arm® Cortex®-M33 application core with a dedicated 200 MHz DSP processing core within a user-friendly 100-pin LQFP package. This combination delivers robust parallel computing capabilities for handling complex real-time control algorithms and intensive digital signal processing tasks simultaneously. Designed for applications demanding both computational power and rich peripheral integration, it serves as an ideal solution for advanced audio processing systems, industrial smart sensors, and edge computing devices where efficient signal analysis, system control, and reliable connectivity are paramount.

Main Features:

Core & Performance

Heterogeneous Dual-Core: Features a 200 MHz Arm® Cortex®-M33 core (with FPU) and a 200 MHz DSP core, enabling parallel execution of control logic and signal processing (e.g., FFT, filtering, audio codecs).

Computational Acceleration: The DSP core supports SIMD and floating-point operations, while the M33 core's FPU accelerates control algorithms.

Advanced Peripherals & Interfaces

Professional Audio Interface: Includes a HIFI-Audio subsystem supporting I2S and S/PDIF for high-fidelity audio input/output.

Comprehensive Connectivity: Offers 10/100M Ethernet MAC, USB 2.0 OTG FS, CAN 2.0B, and multiple USART, I2C, SPI interfaces.

High-Precision Analog: Equipped with high-speed, high-resolution ADC and DAC channels for precise signal acquisition and generation.

Graphics & Vision (To be confirmed for A711): May include a TFT LCD controller with IPA graphics accelerator and a DCMI camera interface, based on series common features.

Memory, Package & Reliability

Substantial Memory: Typically configured with 1024KB (1MB) Flash and 512KB SRAM (verify with datasheet), providing ample space for dual-core firmware, data buffers, and complex applications.

User-Friendly Package (Key Differentiator): The "AV" suffix specifies a 100-pin LQFP package. Compared to BGA variants, LQFP significantly simplifies PCB design (often 2-4 layers), prototyping, debugging, and rework, reducing development cost and risk.

Enhanced Reliability: The "T3TB" suffix indicates an extended industrial temperature range (e.g., -40°C to +105°C) and Tape and Reel packaging for automated assembly in demanding environments.

Typical Applications:

Professional & Consumer Audio: Smart speakers, audio mixers, effects processors, high-fidelity playback systems.

Industrial Sensing & Control: Vibration/acoustic analysis for predictive maintenance, precision measurement instruments, motor control.

Smart IoT Endpoints: Multi-sensor data aggregation gateways, intelligent edge computing nodes.

Automotive & Transportation: In-vehicle audio processing, basic ADAS sensor data conditioning units.