Description：

The GigaDevice GD32F427ZKT6 represents the pinnacle of integration within the GD32F4 series, combining the series' maximum 3072KB (3MB) Flash memory and a comprehensive set of high-end peripherals within a compact 144-pin BGA package. Built around a powerful 200 MHz Arm® Cortex®-M4 core with FPU, this model delivers the ultimate solution for embedded applications that demand both vast code storage for complex graphical interfaces or operating systems and a high-density, space-optimized PCB layout. It is engineered as the definitive single-chip choice for the most sophisticated industrial HMIs, networked multimedia terminals, and edge computing platforms where rich functionality must coexist with a minimal physical footprint.

Main Features：

1. Core & Performance

Top-Tier Processing Performance: 200 MHz Arm® Cortex®-M4 core, integrated with Single-Precision Floating-Point Unit (FPU), supporting DSP instructions.

Dedicated Graphics Acceleration: Built-in IPA (Image Processing Accelerator) hardware graphics accelerator, specifically optimized for 2D graphics operations (fill, blend, rotate) and UI fluidity.

2. Advanced Peripherals & Interfaces

Advanced Display Support: Integrated TFT LCD controller, capable of directly driving RGB interface LCD screens, forming the foundation for building complex graphical interfaces.

Rich High-Speed Connectivity: Provides 10/100M Ethernet MAC, USB 2.0 OTG HS/FS, dual CAN 2.0B, as well as up to 8 serial ports, and multiple I2C/SPI interfaces.

Multimedia Codec: Built-in hardware JPEG codec and Digital Camera Interface (DCMI), supporting fast image/video processing and acquisition.

High-Speed Analog: Features 3 channels of 12-bit ADC (up to 2.6 MSPS) and 2 channels of 12-bit DAC.

3. Memory, Package & Reliability

Maximum Memory Configuration (Key Differentiator): The "K" in the model number is the core identifier, representing that this model is equipped with the largest 3072KB (3MB) Flash and 256KB SRAM in the GD32F4 series. This provides unparalleled storage space for running embedded Linux systems, full-featured RTOS, complex GUI frameworks (e.g., Qt for MCU), and large quantities of font libraries and image resources.

Ball Grid Array Package: The "Z" in the model number represents a 144-pin BGA package. It achieves the smallest physical size and optimal signal integrity while providing ultimate I/O density, but correspondingly requires high-layer-count PCB boards and professional SMT soldering processes.

Industrial-Grade Reliability: The suffix "T6" indicates an operating temperature range of -40°C to +85°C.

Typical Applications：

The combination of "3MB Ultra-Large Flash + BGA Package" is specifically designed for the most complex and space-constrained top-tier applications:

High-End Embedded Smart Terminals: Industrial tablets, high-end Human-Machine Interfaces (HMI), medical display terminals running Linux or complex RTOS.

Networked Multimedia & Communication Equipment: Core processing unit for video conferencing terminals, digital signage players, high-performance Network Video Recorders (NVR).

AI-Integrated IoT Gateways: AIoT gateways that need to integrate visual recognition models and run complex business logic at the edge.

Consumer Electronics Flagship Products: The "brain" for high-end smart home control centers and flagship educational robots, requiring handling of complex interactive interfaces and multi-tasking.