Description：

The GigaDevice GD32F427IEH6 is a member of the GD32F4 series that prioritizes extreme miniaturization. It leverages the powerful 200 MHz Arm® Cortex®-M4 core with FPU and packs the series' core graphical capabilities, including the TFT LCD controller and hardware graphics accelerator (IPA), into an ultra-compact WLCSP (Wafer-Level Chip-Scale Package). This model delivers a compelling combination of high computational performance, advanced display support, and connectivity, all within a footprint designed for the most space-critical applications, making it the ideal choice for next-generation wearable devices, compact medical instruments, and miniature industrial HMIs where board space is at a premium.

Main Features：

1. Core & Performance

High-Performance Core: 200 MHz Arm® Cortex®-M4 core, integrated with Single-Precision Floating-Point Unit (FPU).

Dedicated Graphics Accelerator: Built-in IPA (Image Processing Accelerator) hardware graphics accelerator.

2. Advanced Peripherals & Interfaces

Advanced Display Support: Integrated TFT LCD controller, which is key to providing graphical capabilities in its extremely small size.

High-Speed Connectivity: Provides USB 2.0 OTG FS, CAN 2.0B, as well as multiple USART, I2C, SPI interfaces.

Multimedia Support: Built-in hardware JPEG codec and Digital Camera Interface (DCMI).

High-Speed Analog: Features 3 channels of 12-bit ADC (up to 2.6 MSPS) and 2 channels of 12-bit DAC.

Important Limitation: Due to the extremely compact package, some peripherals available in higher-pin-count packages may be reduced in number or unavailable; for example, the Ethernet MAC is typically not provided in this package.

3. Memory, Package & Reliability

Memory Configuration: The "IE" combination in the model number, where "E" typically represents a configuration of 512KB Flash and 256KB SRAM.

Ultra-Compact Package (Core Differentiator): The "I" in the model number indicates the use of a WLCSP (Wafer-Level Chip-Scale Package). This is a smaller and thinner package form factor than standard BGA, with a typical size as small as 3.5 x 3.5 mm or even smaller, directly using the processed chip wafer as the package body to achieve the smallest physical size.

Consumer/Industrial-Grade Reliability: The suffix "H6" indicates an operating temperature range of -40°C to +85°C.

Typical Applications：

Its extreme size and retained core graphical functions make it the preferred choice for the following ultra-compact devices:

Advanced Wearable Devices: Core processor for smartwatches, high-end fitness trackers, AR/VR glasses.

Portable Medical Equipment: Display and control core for handheld ultrasound devices, portable monitors, smart infusion pumps.

Miniature Industrial Terminals: Local display unit for handheld scanners, mini PLCs, industrial sensors.

Consumer Electronics Micro Modules: Ultra-small core boards that require integrated display and powerful processing capabilities.