Description：

The GigaDevice GD32F427IGH6 stands as the pinnacle of miniaturization and functionality integration within the GD32F4 series. It encapsulates a powerful 200 MHz Arm® Cortex®-M4 core with FPU, along with the series' signature TFT LCD controller and hardware graphics accelerator (IPA), within an ultra-compact WLCSP (Wafer-Level Chip-Scale Package). What sets this model apart is its enhanced 1024KB (1MB) Flash memory in this minute form factor. This combination makes it the ultimate solution for space-constrained next-generation devices that simultaneously demand rich graphical interfaces, substantial code storage, and high processing power, such as sophisticated wearable technology and advanced portable medical equipment.

Main Features：

1. Core & Performance

High-Performance Core: 200 MHz Arm® Cortex®-M4 core, integrated with Single-Precision Floating-Point Unit (FPU).

Dedicated Graphics Accelerator: Built-in IPA (Image Processing Accelerator) hardware graphics accelerator.

2. Advanced Peripherals & Interfaces

Core Graphics Display: Integrated TFT LCD controller, which is key to providing advanced interactive capabilities in its small size.

Basic Connectivity: Provides USB 2.0 OTG FS, CAN 2.0B, and multiple USART, I2C, SPI interfaces. Due to the limitations of the WLCSP package, some high-speed peripherals (e.g., Ethernet MAC) are unavailable, and the number of available interfaces may be reduced.

Multimedia & Analog: Built-in hardware JPEG codec, DCMI camera interface, high-speed ADC, and DAC.

3. Memory, Package & Reliability

Maximum Memory Configuration (Key Differentiator): The "IG" combination in the model number, where "G" indicates it is equipped with the maximum configuration for a WLCSP package—1024KB (1MB) Flash and 256KB SRAM. This provides larger storage space for complex graphical interfaces, rich features, and algorithms compared to the "IE" model (512KB).

Ultra-Compact WLCSP Package: The "I" indicates the use of an extremely compact WLCSP package, with a very small size (approximately 3.5x3.5mm or smaller), designed for products with extreme requirements for thickness and area.

Industrial-Grade Reliability: The suffix "H6" indicates an operating temperature range of -40°C to +85°C.

Typical Applications：

The combination of "Large Memory + Extremely Small Size" makes it the ultimate choice for top-tier compact designs:

Flagship Wearable Devices: High-end smartwatches (running complex UIs and health algorithms), visual processing unit for standalone VR/AR devices.

Precision Portable Medical Equipment: Display and control core for handheld medical imaging devices, high-end continuous glucose monitors, intelligent diagnostic devices.

Miniature High-Performance Terminals: Industrial handheld terminals and special equipment controllers requiring local large-screen display and complex processing.

Space-Optimized Core Modules: Core computing unit for System-in-Package (SiP) or ultra-small core boards.