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GigaDevice GD32A490IKH7

The GigaDevice GD32A490IKH7 is a high-end member of the GD32A4 series, engineered for applications demanding extreme miniaturization without compromising on processing power and signal integrity. It integrates a powerful dual-core architecture—featuring a 200+ MHz Arm® Cortex®-M33 core and a dedicated high-performance DSP core—within an ultra-compact WLCSP (Wafer-Level Chip-Scale Package). This model is tailored for sophisticated portable audio equipment, precision industrial sensing modules, and compact edge AI nodes where space is critically limited, yet performance requirements for audio processing, real-time control, and data analysis are exceptionally high.

Description:

The GigaDevice GD32A490IKH7 is a high-end member of the GD32A4 series, engineered for applications demanding extreme miniaturization without compromising on processing power and signal integrity. It integrates a powerful dual-core architecture—featuring a 200+ MHz Arm® Cortex®-M33 core and a dedicated high-performance DSP core—within an ultra-compact WLCSP (Wafer-Level Chip-Scale Package). This model is tailored for sophisticated portable audio equipment, precision industrial sensing modules, and compact edge AI nodes where space is critically limited, yet performance requirements for audio processing, real-time control, and data analysis are exceptionally high.

Main Features:

1. Core & Performance

Heterogeneous Dual-Core Architecture: Integrates a high-performance Arm® Cortex®-M33 application core and a dedicated DSP signal processing core, enabling hard real-time parallel processing of control and algorithms.

Powerful Computing Capability: The M33 core integrates a Single-Precision Floating-Point Unit (FPU); the DSP core supports SIMD instructions and floating-point operations, optimized for advanced audio algorithms (such as active noise cancellation, voice enhancement) and complex digital filtering.

2. Advanced Peripherals & Interfaces

Professional-Grade Audio Interface: Integrates a High-Performance Audio Interface (HIFI-Audio), supporting I2S, S/PDIF, etc., providing low-distortion, high-fidelity audio data paths.

High-Precision Analog Subsystem: Equipped with industry-leading high-performance, high-speed Σ-Δ ADC and DAC, featuring extremely high signal-to-noise ratio (SNR) and dynamic range, specifically designed for precision measurement and high-quality audio.

Rich Connectivity (Subject to Package Limitations): Provides interfaces such as USB 2.0 OTG FS, CAN-FD, and multiple USART/I2C/SPI. Due to the pin limitations of the WLCSP package, some high-speed interfaces (e.g., Ethernet MAC) may not be available, and the number of available interfaces is limited.

Possible Graphics/Vision Support: Based on the positioning of the GD32A4 series, it may integrate a basic display controller, but the advanced graphics accelerator (IPA) may not be included in this model.

3. Memory, Package & Reliability

Large-Capacity Memory: Based on naming convention inference, the "I" in the model number represents the WLCSP package, and "K" represents a larger Flash capacity, possibly configured with 1024KB (1MB) or 2048KB (2MB) Flash and corresponding SRAM (requires official manual confirmation).

Ultra-Compact Package (Core Differentiator): Uses a WLCSP package, with an extremely small size (typically 4.5 x 4.5 mm or smaller), which is key to achieving ultimate product thinness and lightness.

Extended Industrial Temperature Range: The suffix "H7" most likely indicates support for an extended industrial temperature range of -40°C to +105°C, offering higher reliability than the common "H6" suffix.

Typical Applications:

Its characteristics of "Dual-Core High-Performance Analog + Extreme Size" define its unique position in high-end compact devices:

Professional Portable Audio Equipment: Main control chip for high-end wireless noise-canceling headphones, voice recorders, high-quality portable music players.

Industrial Sensing & Predictive Maintenance: Miniaturized smart sensors based on vibration and sound analysis, industrial equipment health monitoring modules.

High-End Consumer Electronics: Audio and sensor processing unit for AR/VR devices, auxiliary high-fidelity audio subsystem for smartphones.

Automotive Electronics: Compact control modules for Active Noise Cancellation (ANC), Engine Sound Enhancement (ESE), or advanced sensors.


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