Product Description：

The GD32A744AXJ3TB is a high-integration variant in GigaDevice's advanced GD32A744 automotive microcontroller family. It features a powerful Arm® Cortex®-M7 core running at up to 600MHz, enhanced with DSP and AI extensions, delivering top-tier performance for compute-intensive automotive applications. Certified to AEC-Q100 Grade 2 and designed to support ISO 26262 functional safety, it integrates critical automotive features including a dedicated Hardware Security Module (HSM), TSN-ready Gigabit Ethernet, and multiple CAN FD interfaces. Packaged in a Ball Grid Array (BGA) format, this model is tailored for space-optimized, high-density PCB designs commonly found in next-generation domain controllers and central computing platforms where miniaturization and thermal performance are key.

Key Features：

High-Performance Core: Arm Cortex-M7 processor operating at up to 600MHz, equipped with double-precision FPU and DSP extensions for complex algorithm execution and edge AI inference.

Automotive Grade & Functional Safety: Compliant with AEC-Q100 Grade 2 standards (-40°C to +105°C), supporting development for ISO 26262 ASIL-B functional safety level.

Advanced Hardware Security: Integrated, independent Hardware Security Module (HSM) featuring cryptographic accelerators (AES-256, SHA-3, TRNG, ECC/PKC) for robust secure boot, over-the-air (OTA) update security, and encrypted communications.

Large On-Chip Memory: Contains up to 4MB of embedded Flash and 1MB of SRAM (with ECC), providing ample space for sophisticated application code, data logging, and communication buffers.

Comprehensive Connectivity Suite:

2x Gigabit Ethernet controllers with Time-Sensitive Networking (TSN) support.

Up to 6x CAN FD interfaces for high-speed in-vehicle networking.

USB 2.0 OTG (HS/FS), SDIO 2.0, and multiple high-speed SPI/I²C/UART interfaces.

Precision Analog & Control Peripherals: Multiple high-resolution ADCs and DACs, along with advanced PWM timers for precise motor control, power conversion, and sensor interfacing.

High-Density Package: Offered in a Ball Grid Array (BGA) package, enabling a compact footprint, excellent thermal performance, and a high number of interconnect pins for complex system designs.

Typical Applications：

Central Compute/Zone Controllers: As the main processing unit in high-integration vehicle computers, handling sensor fusion, decision-making, and network management.

High-Performance ADAS Domain Controllers: For central processing in Advanced Driver Assistance Systems requiring substantial computational power, fast data throughput, and functional safety.

Next-Generation Smart Cockpit Controllers: Powering integrated digital instrument clusters, head-up displays (HUDs), and infotainment systems in a consolidated architecture.

Electric Vehicle Central Gateways & VCUs: Managing high-speed communication between domains (powertrain, chassis, body) and overseeing vehicle control functions in EVs.

Compact Telematics & Connectivity Units: Serving as the core in high-end Telematics Control Units (TCUs) or V2X modules where space is limited but performance and security are paramount.

High-Reliability Industrial Systems: Used in demanding industrial automation, robotics, and energy control applications that benefit from automotive-grade reliability and high processing density.