Product Description：

The GD32A714BXJ3TB is a space-optimized, high-performance automotive microcontroller from GigaDevice's GD32A714 series. It features an Arm® Cortex®-M7 core operating at up to 400MHz, delivering efficient computational power for advanced automotive control applications. Engineered to meet AEC-Q100 Grade 2 reliability standards and support ISO 26262 functional safety development, it integrates key automotive features such as a Hardware Security Module (HSM) for security and essential high-speed communication interfaces. The defining characteristic of this variant is its Ball Grid Array (BGA) package, making it the ideal choice for next-generation automotive electronic control units (ECUs) that demand the highest level of integration, superior thermal performance, and a minimal footprint on the printed circuit board.

Key Features：

Balanced Performance Core: Arm Cortex-M7 processor operating at up to 400MHz, featuring a double-precision FPU, suitable for a wide range of automotive real-time control and signal processing tasks.

Automotive-Grade Reliability & Safety: Compliant with AEC-Q100 Grade 2 standards (operating temperature: -40°C to +105°C), supporting development for ISO 26262 ASIL-B functional safety level.

Integrated Hardware Security: Equipped with a Hardware Security Module (HSM) that provides cryptographic accelerators (e.g., AES, SHA, TRNG) for secure boot, secure communication (SecOC), and protection against unauthorized access.

Ample On-Chip Memory: Contains substantial embedded Flash memory and SRAM (specifics align with the A714 series, e.g., ~2MB Flash, ~512KB SRAM) to support complex automotive application software and data buffering.

Essential High-Speed Connectivity: Expected to include automotive-standard interfaces such as:

Gigabit Ethernet controller(s) for high-bandwidth data transfer.

Multiple CAN FD interfaces for deterministic in-vehicle networking.

USB, SPI, I²C, and UART for peripheral connectivity.

Precision Analog & Control: Integrates high-resolution Analog-to-Digital Converters (ADCs) and advanced timers with PWM outputs for precise sensor measurement and actuator control (e.g., motor control).

High-Density Package: Utilizes a Ball Grid Array (BGA) package. This enables a very compact physical footprint, excellent thermal dissipation characteristics, and a high number of interconnect pins in a small area, which is critical for miniaturized and complex ECU designs.

Typical Applications：

Advanced Zonal/Zone Controllers: As a high-integration processing node in modern vehicle zonal architectures, managing sensor fusion, power distribution, and data routing within a specific vehicle zone.

High-Density Domain Controllers: For body or chassis domain control units where PCB space is extremely limited but performance and connectivity requirements remain high.

Integrated Smart Actuator Controllers: In applications like advanced LED headlight control, active suspension systems, or advanced thermal management modules, where the controller must be embedded within the actuator assembly itself.

Central Telematics & Gateway Modules: As the core processor in compact, all-in-one telematics and central gateway units that combine connectivity (5G, V2X, Bluetooth) with network routing (CAN FD, Ethernet).

Electric Vehicle Power Electronics: For integrated control within On-Board Chargers (OBC), DC-DC converters, or Battery Management System (BMS) units where a compact, thermally efficient package is advantageous.

Aerospace & High-Reliability Industrial Systems: In applications demanding automotive-grade reliability, high performance per unit volume, and robust operation in harsh environments.