FEATURES:

• Dual-Core Architecture

– Two TMS320C28x 32-bit CPUs

– 200MHz

– IEEE 754 Single-Precision Floating-Point Unit (FPU)

– Trigonometric Math Unit (TMU)

– Viterbi/Complex Math Unit (VCU-II)

• Two Programmable Control Law Accelerators (CLA)

– 200MHz

– IEEE 754 Single-Precision Floating-Point Instructions

– Code execution independent from main CPU

• On-Chip Memory

– 512KB (256KW) or 1MB (512KW) Flash (ECC-protected)

– 172KB (86KW) or 204KB (102KW) RAM (ECC-protected or Parity-protected)

– Dual-zone Security supporting third-party development

– Unique Identification Number

• Clock and System Control

– Two Internal Zero-pin 10MHz Oscillators

– On-chip Crystal Oscillator

– Windowed Watchdog Timer Module

– Missing Clock Detection Circuitry

• 1.2V Core, 3.3V I/O Design

• System Peripherals

– Two External Memory Interfaces (EMIF) supporting ASRAM and SDRAM

– Two 6-Channel Direct Memory Access (DMA) Controllers

– Up to 169 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) pins with Input Filtering

– Expanded Peripheral Interrupt Controller (ePIE)

– Multiple Low-Power Modes (LPM) with External Wake-up Support

• Communication Peripherals

– USB 2.0 (MAC + PHY)

– Universal Parallel Port (uPP) Interface supporting 12 pins, 3.3V compatible

– Two Controller Area Network (CAN) modules (Pin-bootable)

– Three High-Speed (up to 50MHz) SPI ports (Pin-bootable)

– Two Multi-channel Buffered Serial Ports (McBSP)

– Four Serial Communication Interfaces (SCI/UART) (Pin-bootable)

– Two I2C Interfaces (Pin-bootable)

• Analog Subsystem

– Up to Four Analog-to-Digital Converters (ADC)

• 16-Bit Mode

– 1.1MSPS each (System throughput up to 4.4MSPS)

– Differential Inputs

– Up to 12 External Channels

• 12-Bit Mode

– 3.5MSPS each (System throughput up to 14MSPS)

– Single-Ended Inputs

– Up to 24 External Channels

– One Sample-and-Hold (S/H) Circuit per ADC

– Hardware Integrated Post-Processing of ADC Conversions

– Saturation and Offset Calibration

– Error for Setpoint Calculation

– High, Low, and Zero-Crossing Comparison with Interrupt Capability

– Trigger-to-Sample Delay Acquisition

– Eight Window Comparators with 12-bit Digital-to-Analog Converter (DAC) References

– Three 12-bit Buffered DAC Outputs

• Enhanced Control Peripherals

– 24 Pulse Width Modulator (PWM) channels with Enhanced Features

– 16 High-Resolution Pulse Width Modulator (HRPWM) channels

• High-resolution on both A and B channels of 8 PWM modules

• Dead Band support (supported for both Standard and High-resolution)

– 6 Enhanced Capture (eCAP) modules

– Three Enhanced Quadrature Encoder Pulse (eQEP) modules

– 8 Σ-Δ Filter Module (SDFM) input channels, 2 parallel filters per channel

• Standard SDFM data filtering

• Comparator filter for fast response to out-of-range conditions

• Configurable Logic Block (CLB)

– Enhances existing peripheral functionality

– Supports Position Manager solutions

• Functional Safety-Compliant

– Developed for functional safety applications

– Documentation provided to assist ISO 26262 system design up to ASIL D, IEC 61508 up to SIL 3, IEC 60730 Class C, and UL 1998 Class 2 standards

– Hardware integrity up to ASIL B and SIL 2 level

• Safety-Related Certifications

– ISO 26262 certified up to ASIL B and IEC 61508 certified up to SIL 2 by TUV SUD

• Package Options:

– Lead-free, Green packages

– 337-Solder Ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT suffix]

– 176-Pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flat Package (HLQFP) [PTP suffix]

– 100-Pin PowerPAD Thermally Enhanced Thin Quad Flat Package (HTQFP) [PZP suffix]

• Hardware Built-In Self-Test (HWBIST)

• Temperature Options:

– T: –40°C to 105°C Junction Temperature

– S: –40°C to 125°C Junction Temperature

– Q: –40°C to 125°C Ambient Temperature (AEC Q100 Qualified for Automotive Applications)

APPLICATIONS:

• Mid-Range/Short-Range Radar

• Traction Inverter Motor Control

• HVAC Large Commercial Motor Control

• Automated Sorting Equipment

• CNC Control

• AC Charging (Pile) Stations

• DC Charging (Pile) Stations

• Electric Vehicle Charging Station Power Modules

• Energy Storage Power Conversion Systems (PCS)

• Central Inverters

• Solar Power Optimizers

• String Inverters

• Inverters and Motor Control

• On-Board Chargers (OBC) and Wireless Chargers

• Linear Motor Segment Controllers

• Servo Drive Control Modules

• AC Input BLDC Motor Drives

• DC Input BLDC Motor Drives

• Industrial AC-DC

• Three-Phase UPS