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Kioxia THGBMDG5D1LBAIL Datesheet

The Kioxia THGBMTG5D1LBAIL is a 4 GB density embedded MultiMediaCard (e-MMC) module packaged in a 153-ball BGA (P-WFBGA153-1113-0.50) with dimensions of 11.5 mm x 13 mm and a maximum height of 0.8 mm. This unit integrates advanced NAND flash device(s) and a controller chip assembled as a Multi Chip Module (MCM). The THGBMTG5D1LBAIL features an industry-standard MMC protocol interface compliant with JEDEC/MMCA Version 5.0, supporting 1-I/O, 4-I/O, and 8-I/O modes for flexible host integration. It provides a complete managed NAND solution, handling low-level flash management including error correction, wear leveling, and bad block management, thereby simplifying system design and reducing time-to-market. Typical applications include smartphones, tablets, embedded computing, industrial control systems, and portable consumer electronics requiring reliable, high-density storage in a compact footprint.

INTRODUCTION:

THGBMTG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilizedadvanced NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMTG5D1LBAIL has anindustry standard MMC protocol for easy use.

FEATURES:

THGBMTG5D1LBAIL Interface

THGBMTG5D1LBAIL has the JEDEC / MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.

Pin Connection:

P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max.) package)


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