INTRODUCTION:
THGBMTG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilizedadvanced NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMTG5D1LBAIL has anindustry standard MMC protocol for easy use.
FEATURES:
THGBMTG5D1LBAIL Interface
THGBMTG5D1LBAIL has the JEDEC / MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection:
P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max.) package)
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