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HYNIX H5AG36EXNDX017N Datesheet

The H5AG36EXNDX017N is a high-speed CMOS Double Data Rate IV (DDR4) Synchronous DRAM organized as 8Gb, designed for main memory applications requiring large density and high bandwidth. This device operates from a 1.2V ± 0.06V power supply (VDD and VDDQ) and is compliant with JEDEC standards. It features fully differential clock inputs (CK, CK) and differential data strobes (DQS, DQS). All addresses and control inputs are latched on the rising edge of CK, while data, data strobes, and write data masks are sampled on both rising and falling edges. An on-chip DLL aligns DQ, DQS, and DQS transitions with the CK transition, and internal 8-bit prefetch architecture enables very high bandwidth. The device supports programmable burst lengths of 4 or 8, 16 internal banks, dynamic on-die termination (ODT), write levelization, ZQ calibration, and advanced low-power modes including temperature-controlled auto refresh (TCAR) and low-power auto self refresh (LP ASR). Additional features include writ

Description:

The H5AG34EXNDX026N, H5AG38EXNDX026N, H5AG36EXNDX017N, H5AG38EXNJX026N, H5AG36EXNJX017N is a 8Gb CMOS Double Data Rate IV (DDR4) Synchronous DRAM, ideally suited for the main memoryapplications which requires large memory density and high bandwidth. SK hynix 8Gb DDR4 SDRAMs offerfully synchronous operations referenced to both rising and falling edges of the clock. While all addressesand control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobesand Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.

FEATURES:

• VDD=VDDQ=1.2V +/- 0.06V

• Fully differential clock inputs (CK, CK) operation

• Differential Data Strobe (DQS, DQS)

• On chip DLL align DQ, DQS and DQS transition with CKtransition

• DM masks write data-in at the both rising and fallingedges of the data strobe

• All addresses and control inputs except data, datastrobes and data masks latched on the rising edges ofthe clock

• Programmable burst length 4/8 with both nibblesequential and interleave mode

• BL switch on the fly

• 16banks

• Average Refresh Cycle (Tcase of 0 oC~ 95 oC)- 7.8 µs at 0oC ~ 85 oC- 3.9 µs at 85oC ~ 95 oC

• JEDEC standard 78ball FBGA(x4/x8), 96ball FBGA(x16)

• Driver strength selected by MRS

• Dynamic On Die Termination supported

• Two Termination States such as RTT_PARK andRTT_NOM switchable by ODT pin

• Asynchronous RESET pin supported

• ZQ calibration supported

• TDQS (Termination Data Strobe) supported (x8 only)

• Write Levelization supported

• 8 bit pre-fetch

• This product in compliance with the RoHS directive.

• Internal Vref DQ level generation is available

• Write CRC is supported at all speed grades

• Maximum Power Saving Mode is supported

• TCAR(Temperature Controlled Auto Refresh) mode issupported

• LP ASR(Low Power Auto Self Refresh) mode is supported

• Fine Granularity Refresh is supported

• Per DRAM Addressability is supported

• Geardown Mode(1/2 rate, 1/4 rate) is supported

• Programable Preamble for read and write is supported

• Self Refresh Abort is supported

• CA parity (Command/Address Parity) mode is supported

• Bank Grouping is applied, and CAS to CAS latency(tCCD_L, tCCD_S) for the banks in the same or differentbank group accesses are available

• DBI(Data Bus Inversion) is supported(x8)

• MBIST PPR is supported


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