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TI CSD95410RRB Datesheet

The CSD95410RRB is a highly optimized NexFET™ power stage designed for high‑power, high‑density synchronous buck converters. It integrates a driver IC and power MOSFETs in a compact 5 mm × 6 mm QFN package, enabling high current capability (90‑A peak continuous), high efficiency (exceeding 95% at 30 A), and high‑speed switching up to 1.75 MHz. The device features temperature‑compensated bidirectional current sensing and analog temperature output to simplify system design while improving accuracy. Additional features include diode emulation, fault monitoring, tri‑state PWM input compatible with 3.3 V and 5 V logic, integrated bootstrap switch, and optimized dead‑time for cross‑conduction protection. The thermally enhanced top‑side cooling, ultra‑low inductance package, and system‑optimized PCB footprint make the CSD95410RRB ideal for space‑constrained, high‑current applications. It is RoHS compliant, lead‑free, and halogen‑free.

Description:

The CSD95410 NexFET™ Power Stage is a highly optimized design for high-power, high-density synchronous buck converters. This product integrates a driver IC and power MOSFETs to enable the power stage switching function. The combination is offered in a small 5mm × 6mm package, achieving high current, high efficiency, and high-speed switching capability. It also integrates accurate current sensing and temperature sensing to simplify system design and improve accuracy. Additionally, the PCB footprint has been optimized to help reduce design time and simplify overall system design completion.

Features:

• 90A peak continuous current

• System efficiency exceeding 95% at 30A

• High operating frequency (up to 1.75 MHz)

• Diode emulation function

• Temperature-compensated bidirectional current sensing

• Analog temperature output

• Fault monitoring

• Compatible with 3.3V and 5V PWM signals

• Tri-state PWM input

• Integrated bootstrap switch

• Optimized cross‑conduction protection dead‑time

• High‑density industry‑standard 5mm × 6mm QFN package

• Ultra‑low inductance package

• System‑optimized PCB footprint

• Thermally enhanced top‑side cooling

• RoHS compliant, lead‑free terminal plating

• Halogen‑free

Applications:

• Multiphase synchronous buck converters – High‑frequency applications – High‑current, low‑duty‑cycle applications

• Point‑of‑load DC/DC converters

• Memory and graphics cards

• Desktop and server VR12.x/VR13.x/VR14.x core voltage synchronous buck converters


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