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Altera 10CX085YU484I6G STOCK

Compared with previous generations of Cyclone® FPgas, Intel® Cyclone® 10 FPgas have lower costs and power consumption. The Cyclone 10 GX device offers wide bandwidth through 10.3Gbps transceiver functionality, 1833Mbps DDR3, and 1.4Gbps LVDS I/O. The Cyclone® 10 LP device features extremely low power consumption and cost, making it suitable for general circuit board control, chip-to-chip bridging, or motor/motion control. Cyclone® 10 GX is optimized for high-bandwidth performance applications such as industrial vision, robotics, and automotive infotainment. Cyclone® 10 LP is optimized for low-power and low-cost applications such as I/O expansion, sensor fusion, motor/motion control, chip-to-chip bridging, and circuit board management control. Cyclone® 10 GX and LP support vertical migration. The design can start from one device and be migrated to adjacent devices after the final design is determined.

Altera Cyclone 10 FPGA:

Compared with previous generations of Cyclone® FPgas, Intel® Cyclone® 10 FPgas have lower costs and power consumption. The Cyclone 10 GX device offers wide bandwidth through 10.3Gbps transceiver functionality, 1833Mbps DDR3, and 1.4Gbps LVDS I/O. The Cyclone® 10 LP device features extremely low power consumption and cost, making it suitable for general circuit board control, chip-to-chip bridging, or motor/motion control.

Cyclone® 10 GX is optimized for high-bandwidth performance applications such as industrial vision, robotics, and automotive infotainment.

Cyclone® 10 LP is optimized for low-power and low-cost applications such as I/O expansion, sensor fusion, motor/motion control, chip-to-chip bridging, and circuit board management control. Cyclone® 10 GX and LP support vertical migration. The design can start from one device and be migrated to adjacent devices after the final design is determined.

Feature:

Intel® Cyclone® 10 LP features

Low-cost, low-power FPGA architecture

1.0V and 1.2V core voltage options

Suitable for commercial, industrial and automotive temperature grades

Several packaging types and spatial layouts:

FineLine BGA (FBGA)

Enhanced Thin Quad Flat Pack (EQFP)

Ultra FineLine BGA (UBGA)

Micro FineLine BGA (MBGA)

Multi-device density with pin migration capability

Complies with the RoHS6 directive

Logic unit - four-input lookup table (LUT) and registers

Rich wiring/metal interconnections between all Les

M9k-9 kilobits (Kb) embedded SRAM memory module that can be cascaded

Intel® Cyclone® 10 GX features

Based on TSMC's 20nm process technology

Its performance is twice that of the previous generation of low-cost FPgas

Short-distance rate up to 10.3125 gigabits per second (Gbps)

Hard PCI Express IP blocks support Gen2 ×4 applications

8-channel input adaptive logic module (ALM

Embedded memory up to 11.74 megabits (Mb)

Precision adjustable digital signal processing (DSP) block

Decimal Comprehensive Phase-locked Loop (PLL

The hardcore storage controller and PHY can reach up to 1,866 megabits per second (Mbps)

A complete set of advanced energy-saving features

Optimize the MultiTrack wiring and core architecture of the power supply

Application:

Intel® Cyclone® 10 LP application

I/O extension

Interface

Bridge

Sensor fusion

Industrial motor control

Intel® Cyclone® 10 GX application

Automotive infotainment system

Intelligent vision camera

Industrial robot

Machine vision

Industrial programmable logic controller

Pro-AV system


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