Description:

The GD32A723VH6 is a flagship automotive-grade general-purpose microcontroller from GigaDevice's GD32A series. Built on a high-performance 350 MHz Arm® Cortex®-M7 core, it delivers exceptional computational power and real-time responsiveness. Designed for demanding automotive electronic applications, it integrates rich communication interfaces including CAN FD, TSN-enabled Ethernet, and advanced hardware security features. Compliant with AEC-Q100 Grade 2 and functional safety mechanisms targeting ASIL-B, it ensures high reliability and robustness for next-generation vehicle electrification and intelligence.

Features:

Core: High-performance 350 MHz Arm® Cortex®-M7 with double-precision FPU and L1 cache (16KB I-Cache/16KB D-Cache).

Memory: Up to 1MB embedded Flash, 512KB SRAM (including 64KB TCM).

Automotive Reliability: AEC-Q100 Grade 2 qualified (-40°C to +105°C). Enhanced ESD/EFT protection. Dedicated power monitoring (POR, LVD, BOR).

Functional Safety: Hardware features (ECC, SRAM parity, clock/power monitoring, dual watchdog timers) supporting system development to ASIL-B (ISO 26262).

Advanced Connectivity: Up to 4x CAN FD, 1x 10/100M TSN-capable Ethernet MAC, 4x USART, 4x I2C, 4x SPI/I2S, 1x SDIO.

Hardware Security: Embedded Hardware Security Module (HSM) including AES-128/192/256, SHA-1/224/256, and TRNG.

High-Precision Timing: Two advanced 16-bit PWM timers for motor control.

Analog: 3x 16-bit 4.2 MSPS ADCs (up to 24 channels), 2x 12-bit DACs.

Package: LQFP144.

Applications:

Vehicle Gateway & Domain Controller: Centralized computing platforms leveraging high-speed Ethernet and CAN FD.

Advanced Driver Assistance Systems (ADAS): Front camera, surround view, radar sensor processing.

Vehicle Chassis & Safety: Electronic stability control, electric power steering.

Body & Comfort Electronics: Smart lighting, intelligent door/window/seat control, HVAC systems.

Vehicle Electrification: On-board chargers (OBC), battery management systems (BMS), DC-DC converters.

High-Performance HMI: Instrument clusters and connectivity modules.