Gigadevice's SPI Nor Flash and SPI NAND Flash can provide WLCSP Packaging (Wafer Level Chip Scale Packaging). Unlike traditional plastic packaging, WLCSP is a wafer-level chip packaging method that can provide packaging sizes the same as the wafer size. Our WLCSP can be as small as less than 1mm in both length and width, and as thin as 0.25mm, offering an incomparable size advantage. Meanwhile, WLCSP packaging can also enhance the heat dissipation of the chip. Enhance the stability of data transmission. From small size to low power consumption, GigaDevice has broken through the physical limits of storage devices by using WLCSP packaging. Now, WLCSP packaging has been widely applied in wearable applications. With the development of the market demand for miniaturization, WLCSP will become one of the important packaging forms in the future.

Automotive-grade SPI NOR Flash：

◆ Meet the AEC-Q100 Grade1 standard

◆ 3V/1.8V/1.65V - 3.6V* SPI NOR Flash series

◆ It adopts 55nm/45nm process and has a capacity of 2Mb to 2Gb

◆ Support PPAP

◆ Support Long-Term Supply (PLP)

◆ Passed the ISO 26262:2018 ASIL D automotive functional safety certification

◆ Aim for 0ppm and persist in continuous improvement

◆ Working temperature range: -40℃ to +125℃

◆ Optional packaging methods that comply with automotive standards

Performance parameters:

Status :UD

Voltage :1.65V to 2.0V 1.10 V to 1.30 V

Capacity :128Mb

Temperature (industrial):-40℃ to 85℃ - 40 ℃ ~ 105 ℃; - 40 ℃ ~ 125 ℃

I/O bus :Single I/O; OPI; DTR

Frequency (MHz):200(x1 x8) 200(x8 DTR)

Main features :ECC; DTR; H/W RESET; WP#; Security Registers with OTP Locks; Suspend; Unique ID

Packaging :TFBGA24 8x6mm (5x5 ball array); WLCSP (4x6 ball array)