Description:

The GD30TS103N series temperature sensors are all in4-Ball wafer-level packages, of which the GD30TS103Nhas a resolution of 1°C.The two-wire interface of the GD30TS103N series iscompatible with SMBus and I2C communication modes,and supports multi-chip access (MDA) commands,which can realize the communication between the hostand multiple chips on the bus at the same time, withoutsending separate read and write commands to eachGD30TS103N series chip. GD30TS103N supports up to8 different address chips to be mounted on a main line.The GD30TS103N series is suitable for the system withlimited temperature measurement area, temperaturesensitivity, and multi-temperature area measurementand monitoring. The rated operating temperature rangeof the GD30TS103N series is −40°C to +125°C.

Features:

• Multiple Device Access (MDA):

–Global read and write operations

• Temperature range: −40°C to +125°C

• Temperature accuracy:

– ±1°C (−40°C to +125°C)

• Supply voltage range:– 1.4V to 2.8V

• Low quiescent current：

– Normal operation: ≤3uA (0.25Hz)

– Off mode: ≤1μA

• Resolution:– 8bits(GD30TS103N)

• Digital output: compatible with SMBus™ andI2C interface

• Package:– 4-Ball WLCSP(DSBGA)

Applications:

• Phone

• Laptop

• Solid State Drive (SSDs)

• Server

• Set top box

• Low power environment

• Sensor