Product Description：

The GD32A724BZT3TB is a high-performance automotive microcontroller from GigaDevice's GD32A724 series, engineered to bridge the gap between computational power and rich connectivity. At its core is an Arm® Cortex®-M7 processor operating at up to 500MHz, delivering robust processing capabilities for complex real-time control and data processing tasks. Designed for the evolving automotive E/E architecture, it meets AEC-Q100 Grade 2 standards and supports ISO 26262 functional safety development. This MCU distinguishes itself with a potent combination of a high-frequency core, an enhanced Hardware Security Module (HSM) for advanced cybersecurity, and a comprehensive suite of high-speed communication interfaces, including TSN-enabled Ethernet and multiple CAN FD channels. Packaged in an LQFP144 form factor, it is tailored for demanding automotive applications such as advanced domain controllers, integrated vehicle gateways, and high-performance EV subsystems.

Key Features：

High-Speed Compute Core: Features an Arm Cortex-M7 core running at up to 500MHz, equipped with a double-precision FPU and DSP extensions. This provides the necessary horsepower for signal processing, model-based control algorithms, and lightweight data fusion.

Automotive Cybersecurity Hub: Incorporates an enhanced Hardware Security Module (HSM) with a complete cryptographic engine suite (AES-256, SHA-2/3, TRNG, ECC). It supports advanced security features like secure boot, hardware-based key storage, and accelerated secure communication (MACsec, IPsec, SecOC).

Automotive Reliability & Safety: Compliant with AEC-Q100 Grade 2 standards (-40°C to +105°C). The MCU is architected to support system development targeting ISO 26262 ASIL-B functional safety level.

Comprehensive Connectivity Suite: Built for networked vehicle domains:

Dual Gigabit Ethernet controllers with Time-Sensitive Networking (TSN) support for deterministic, high-bandwidth backbone communication.

Up to 6x CAN FD interfaces for high-speed in-vehicle networking.

USB 2.0 OTG HS, SDIO, and multiple high-speed SPI/I²C/UART interfaces.

High-Capacity On-Chip Memory: Equipped with large embedded memory, typically ~3MB of Flash and ~1MB of SRAM (with ECC support), sufficient for hosting sophisticated AUTOSAR stacks, application code, and communication buffers.

Advanced Analog & Control Peripherals: Includes high-resolution ADCs (16-bit capable) and DACs for precision sensing and actuation. Features multiple advanced timers for complex PWM generation required in motor control and digital power conversion.

Balanced Package: Utilizes an LQFP144 package, offering an excellent balance between a high pin count for peripheral connectivity and good manufacturability for complex ECU designs.

Typical Applications：

Integrated Domain Controller: For powertrain, chassis, or body domains requiring significant local processing power, sensor fusion, and actuator control within a single ECU.

Central Vehicle Gateway: As a high-performance gateway/router, securely managing data flow between CAN FD, Ethernet TSN, and other network segments with protocol conversion and firewall capabilities.

Electric Vehicle Central Control Unit (VCU): Managing vehicle-level coordination, torque vectoring, and energy management in BEVs/HEVs.

Advanced Suspension or Steering Control: For electric power steering (EPS) or active suspension systems demanding high-frequency control loops and functional safety.

High-End Telematics & Connectivity Unit: Acting as a powerful hub for 5G, V2X, and GNSS data processing, requiring both high throughput and strong security.

Industrial Automation & Robotics: For high-speed motion control, vision systems, and industrial communication gateways that benefit from automotive-grade reliability.