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Features:
Silicon Chip on Direct-Copper Bond(DCB) Substrate
Isolated Mounting Surface
3000V Electrical Isolation
High Blocking Voltage
International Standard Package
Low Conduction Losses
Advantages:
Low Gate Drive Requirement
High Power Density
Applications:
Switched-Mode and Resonant-ModePower Supplies
Uninterruptible Power Supplies (UPS)
Laser Generators
Capacitor Discharge Circuits
AC Switches
You can get your IXYS IXBF32N300 STOCK solution by flling out the form below and we will contact you immediately.
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