Features：

 Flexible Logic Architecture

• Six devices with 256 to 6864 LUT4s and18 to 334 I/Os

 Ultra Low Power Devices

• Advanced 65 nm low power process

• As low as 22 µW standby power

• Programmable low swing differential I/Os

• Stand-by mode and other power saving options

 Embedded and Distributed Memory

• Up to 240 kbits sysMEM™ Embedded BlockRAM

• Up to 54 kbits Distributed RAM

• Dedicated FIFO control logic

 On-Chip User Flash Memory

• Up to 256 kbits of User Flash Memory

• 100,000 write cycles

• Accessible through WISHBONE, SPI, I2C andJTAG interfaces

• Can be used as soft processor PROM or asFlash memory

 Pre-Engineered Source Synchronous I/O

• DDR registers in I/O cells

• Dedicated gearing logic

• 7:1 Gearing for Display I/Os

• Generic DDR, DDRX2, DDRX4

• Dedicated DDR/DDR2/LPDDR memory withDQS support

 High Performance, Flexible I/O Buffer

• Programmable sysIO™ buffer supports widerange of interfaces:

– LVCMOS 3.3/2.5/1.8/1.5/1.2

– LVTTL

– PCI

– LVDS, Bus

-LVDS, MLVDS, RSDS, LVPECL

– SSTL 25/18

– HSTL 18

– Schmitt trigger inputs, up to 0.5 V hysteresis

• I/Os support hot socketing

• On-chip differential termination

• Programmable pull-up or pull-down mode

Flexible On-Chip Clocking

• Eight primary clocks

• Up to two edge clocks for high-speed I/Ointerfaces (top and bottom sides only)

• Up to two analog PLLs per device withfractional-n frequency synthesis

– Wide input frequency range (7 MHz to400 MHz)

 Non-volatile, Infinitely Reconfigurable

• Instant-on – powers up in microseconds

• Single-chip, secure solution

• Programmable through JTAG, SPI or I2C

• Supports background programming of non-volatile memory

• Optional dual boot with external SPI memory

 TransFR™ Reconfiguration

• In-field logic update while system operates

 Enhanced System Level Support

• On-chip hardened functions: SPI, I2C, timer/counter

• On-chip oscillator with 5.5% accuracy

• Unique TraceID for system tracking

• One Time Programmable (OTP) mode

• Single power supply with extended operatingrange

• IEEE Standard 1149.1 boundary scan

• IEEE 1532 compliant in-system programming

 Broad Range of Package Options

• TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA,fpBGA, QFN package options

• Small footprint package options

– As small as 2.5 mm x 2.5 mm

• Density migration supported

• Advanced halogen-free packaging