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STMicroelectronics LSM6DSV16B

The STMicroelectronics LSM6DSV16B is a high-performance system-in-package inertial measurement unit (IMU) that integrates a 3-axis digital accelerometer and a 3-axis digital gyroscope. Designed specifically for hearable and wearable applications, it features a unique dual-channel architecture for simultaneous motion tracking and bone conduction vibration detection, each with dedicated configuration, processing, and filtering. The device includes a 3-axis audio accelerometer with flat wide bandwidth (>1 kHz) and low noise (20 μg/√Hz), enabling advanced audio enhancement and voice pickup via bone conduction. Operating at 0.6 mA in high-performance mode, it embeds advanced processing features such as a programmable Finite State Machine (FSM), sensor fusion low-power (SFLP) algorithm, and adaptive self-configuration (ASC). With a compact footprint of 2.5 mm x 3 mm x 0.71 mm, the LSM6DSV16B is fully compliant with ECOPACK and RoHS standards.

Description:

The LSM6DSV16B is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with dual channels for processing acceleration and angular rate sensing data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction on separate channels with dedicated configuration, processing, and filtering.The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.The LSM6DSV16B embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), and adaptive self-configuration (ASC).The LSM6DSV16B integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).

Features:

• Dual channels for motion tracking and bone conduction

• Power consumption: 0.95 mA in combo high-performance mode

• “Always-on" experience with low power consumption for both accelerometer and gyroscope

• Smart FIFO up to 4.5 KB

• ±2/±4/±8/±16 g full scale

• ±125/±250/±500/±1000/±2000/±4000 dps full scale

• 3-axis audio accelerometer with flat and wide bandwidth > 1 kHz and low noise 20 μg /√Hz

• SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization

• TDM slave interface

• Advanced pedometer, step detector, and step counter

• Significant motion detection, tilt detection

• Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click

• Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz

• Embedded adaptive self-configuration (ASC)

• Embedded sensor fusion low-power algorithm

• Embedded temperature sensor

• Analog supply voltage: 1.71 V to 3.6 V

• Independent IO supply (extended range: 1.08 V to 3.6 V)

• Compact footprint: 2.5 mm x 3 mm x 0.71 mm

• ECOPACK and RoHS compliant

Applications:

• TWS (true wireless stereo)

• Wearables

• IoT and connected devices

• User interface & power management for wearable and hearable devices


How to Order

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