Description:

The LSM6DSV320X is a high-end, low-noise, low-power, small IMU, featuring a 3-axis digital low-g accelerometer at 16 g, a 3-axis digital high-g accelerometer at 320 g, and a 3-axis digital gyroscope, which offers the best IMU sensor with an architecture for processing acceleration and angular rate data on four separate channels (user interface, OIS, EIS, and high-g accelerometer data). This IMU enables a new range of applications targeting emergency calls, fall/drop reconstruction, intense movement tracking, concussion monitoring, and so forth.The device enables edge AI computing, leveraging a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for personal electronics and IoT applications.

The LSM6DSV320X features adaptive self-configuration (ASC) to optimize power consumption. The sensor can automatically adjust its settings in real time upon detecting a specific motion pattern or signal from the MLC, without intervention from the host processor. The digital circuitry also includes ST’s sensor fusion low-power (SFLP) technology for spatial orientation.The device embeds a

dedicated accelerometer sensor with an independent channel and filtering for high-g acceleration detection that perfectly matches shock requirements for sports, concussion detection, shock detection, and a full range of car crash detection applications.

Features：

• Quad-channel architecture for UI, EIS, OIS, and high-g data processing

• "Smart, always-aware" experience for system power optimization

• Dual accelerometer channels

– Low-g channel ±2/±4/±8/±16 g full scale

– High-g channel ±32/±64/±128/±256/±320 g full scale

• Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps

• SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization

• Auxiliary SPI & MIPI I3C® v1.1 for OIS data output for gyroscope and accelerometer

• Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz

• Machine learning core with exportable features and filters for AI applications

• Embedded adaptive self-configuration (ASC)

• Embedded sensor fusion low-power (SFLP) algorithm

• OIS configurable from the auxiliary or primary interface

• EIS dedicated channel on primary interface with dedicated filtering

• Advanced pedometer, step detector, and step counter

• Significant motion detection, tilt detection

• Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock

• Smart FIFO up to 4.5 KB

• Embedded temperature sensor

• Independent I/O supply

– I²C voltage range: 1.62 V to 3.6 V

– SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V

• Supply current

– 6-axis configuration @ 0.67 mA in combo high-performance mode

– 9-axis configuration @ 0.80 mA in combo high-performance mode

• Compact footprint: 2.5 mm x 3 mm x 0.83 mm

• ECOPACK and RoHS compliant

Applications：

• Smartphones

• Wearables

• Smart tags

• Asset monitors

• Event data recorders (EDRs)

• Structural health monitoring (SHM) of buildings and bridges

• Personal protective equipment (severity of falls or impacts)

• Gaming controllers