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TI ESD122DMXR Datesheet

The ESD122 is a bidirectional TVS ESD protection diode array specifically designed for USB Type-C and HDMI 2.0 circuit protection. Rated to dissipate ESD strikes at the maximum IEC 61000-4-2 Level 4 levels (±17kV contact discharge, ±17kV air-gap discharge), the device withstands more than 10,000 ESD strikes without performance degradation, ensuring robust long-term reliability. Featuring ultra-low I/O capacitance of 0.1pF (typical between I/Os) and 0.2pF (typical from I/O to GND), the ESD122 accommodates symmetric differential high-speed signal routing, making it ideal for protecting high-speed interfaces up to 10Gbps, including USB 3.1 Gen 2, HDMI 2.0, Thunderbolt, DisplayPort, and PCI Express. Low dynamic resistance and low clamping voltage (8.4V at 5A TLP) ensure excellent system-level transient protection. The device is specifically optimized for USB Type-C Tx/Rx lines—using four 2-channel ESD122 devices instead of a single 4-channel device minimizes VIAs and simplifies PCB layout,

Description:

The ESD122 is a bidirectional TVS ESD protection diode array designed for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified by the IEC 61000-4-2 international standard (17kV contact discharge, 17kV air-gap discharge). The device features low I/O capacitance per channel and per pin to accommodate symmetric differential high-speed signal routing, making it an ideal choice for protecting high-speed interfaces up to 10Gbps, such as USB 3.1 Gen 2 and HDMI 2.0. Low dynamic resistance and low clamping voltage ensure system-level protection against transient events. Furthermore, the ESD122 is an ideal ESD solution for USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using a 4-channel ESD device requires VIAs that degrade signal integrity. Using four ESD122 (2-channel) devices minimizes the number of VIAs and simplifies board layout. The ESD122 is offered in two easy, flow-through routing packages.


Features:

• IEC 61000-4-2 Level 4 Electrostatic Discharge (ESD) Protection

– ±17kV contact discharge

– ±17kV air-gap discharge

• Withstands more than 10,000 ESD strikes without any performance degradation per IEC 61000-4-2 Level 4 (contact)

• IEC 61000-4-4 Electrical Fast Transient (EFT) Protection

– 80A (5/50ns)

• IEC 61000-4-5 Surge Protection

– 2.5A (8/20µs)

• Low I/O capacitance – 0.1pF (typical) between I/Os

– 0.2pF (typical) from I/O to GND

• DC breakdown voltage: 5.1V (minimum)

• Ultra-low leakage current: 10nA (maximum)

• Low ESD clamping voltage: 8.4V at 5A TLP

• Supports high-speed interfaces up to 10Gbps

• Industrial temperature range: –40°C to +125°C

• Type-C friendly, 2-channel flow-through routing package

• Pinout suited for symmetric differential high-speed signal routing

• Two different package options

– 0402 package, 0.6mm × 1mm, 0.34mm pitch

– 0502 package, 0.6mm × 1.32mm, 0.5mm pitch


Applications:

• End Equipment

– Mobile phones and tablets

– Portable and desktop computers

– Set-top boxes

– TVs and monitors

– Servers

• Interfaces

– USB Type-C

– HDMI 2.0/1.4

– USB 3.1 Gen 2/Gen 1, USB 3.0 and USB 2.0

– Thunderbolt-1 and Thunderbolt-2

– DisplayPort 1.3

– PCI Express 3.0 bus interfaces

– Serial ATA (SATA)


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