GENERAL DESCRIPTION:

The ADIN1300 is a low power, single port, Gigabit Ethernet transceiver with low latency and power consumption specifications primarily designed for industrial Ethernet applications.This design integrates an energy efficient Ethernet (EEE) physical layer device (PHY) core with all associated common analogcircuitry, input and output clock buffering, management interfaceand subsystem registers, and MAC interface and control logic tomanage the reset and clock control and pin configuration.The ADIN1300 is available in a 6 mm × 6 mm, 40-lead leadframe chip scale package (LFCSP). The device operates with aminimum of 2 power supplies, 0.9 V and 3.3 V, assuming the useof a 3.3 V MAC interface supply. For maximum flexibility in systemlevel design, a separate VDDIO supply enables the managementdata input/output (MDIO) and MAC interface supply voltages to beconfigured independently of the other circuitry on the ADIN1300,allowing operation at 1.8 V, 2.5 V, or 3.3 V. At power-up, theADIN1300 is held in hardware reset until each of the supplies hascrossed its minimum rising threshold value. Brown-out protectionis provided by monitoring the supplies to detect if one or moresupply drops below a minimum falling threshold (see Table 19), andholding the device in hardware reset until the power supplies returnand satisfy the power-on reset (POR) circuit.The MII management interface (also referred to as MDIO interface)provides a 2-wire serial interface between a host processor or MAC(also known as management station (STA)) and the ADIN1300,allowing access to control and status information in the PHY coremanagement registers. The interface is compatible with both theIEEE 802.3 Standard Clause 22 and Clause 45 management framestructures.The ADIN1300 can support cable lengths up to 150 meters atGigabit speeds and 180 meters when operating at 100 Mbps or10 Mbps.Note that throughout this data sheet, multifunction pins, such asXTAL_I/CLK_IN/REF_CLK, are referred to either by the entire pinname or by a single function of the pin, for example, XTAL_I/CLK_IN, when only that function is relevant.

FEATURES:

► 10BASE-Te/100BASE-TX/1000BASE-T IEEE 802.3 compliant

► MII, RMII, and RGMII MAC interfaces

► 1000BASE-T RGMII latency transmit <68 ns, receive <226 ns

► 100BASE-TX MII latency transmit <52 ns, receive <248 ns

► Programmable RGMII timing delay and drive current

► Supports TSN

► EMC test standards

► IEC 61000-4-5 surge (±4 kV)

► IEC 61000-4-4 electrical fast transient (EFT) (±4 kV)

► IEC 61000-4-2 ESD (±6 kV contact discharge)

► IEC 61000-4-6 conducted immunity (10 V)

► EN55032 radiated emissions (Class A)

► EN55032 conducted emissions (Class A)

► Unmanaged configuration using multilevel pin strapping

► MDIO/MDC management interface and interrupt pin

► EEE in accordance with IEEE 802.3az

► Start of packet detection for IEEE 1588 time stamp support

► Enhanced link detection

► Voltage mode MDI drivers, eliminates termination resistors

► RJ45 MDI flip capability

► Automatic polarity and pair swap correction

► Cable diagnostics (TDR and signal analysis)

► Frame generator and checker, multiple loopback modes

► Configurable LED

► Crystal oscillator frequency/25 MHz clock input frequency (50MHz for RMII)

► 25 MHz/125 MHz synchronous clock output

► Jumbo frame support up to 16 kB

► Small package and wide temperature range

► 40-lead, 6 mm × 6 mm LFCSP

► Specified for −40°C to +105°C ambient operation

► Low power consumption

► 330 mW for 1000BASE-T

► 140 mW for 100BASE-TX

► 3.3 V/2.5 V/1.8 V MAC interface VDDIO supply

► Integrated power supply monitoring and POR

APPLICATIONS:

► Industrial automation

► Process control

► Factory automation

► Robotics/motion control