Gigadevice's WLCSP package is compact in size, enabling designers to maximize the utilization of PCB space. WLCSP packaging is the smallest size packaging method, the same as the chip size. This packaged product is powered by 1.2V,1.8V and 1.65V to 3.6V voltages, which can meet the design requirements of low-power compact mobile devices including mobile phones.

Performance parameters:

Status :NR

Voltage :1.65V to 2.0V

Capacity :512Mb

Temperature (industrial):-40℃ to 85℃ - 40 ℃ ~ 105 ℃; - 40 ℃ ~ 125 ℃

I/O bus :Single I/O; Quad I/O; QPI; DTR

Frequency (MHz):166(x1 x4) 90(x4 DTR)

Main features :DTR; Default 4I/O; H/W RESET; WP#; Security Registers with OTP Locks; Suspend;Unique ID

Package :SOP16 300mi; WSON8 8x6mm; TFBGA24 8x6mm (5x5 ball array); WLCSP (3-2-3 ball array)