Gigadevice's WLCSP package is compact in size, enabling designers to maximize the utilization of PCB space. WLCSP packaging is the smallest size packaging method, the same as the chip size. This packaged product is powered by 1.2V,1.8V and 1.65V to 3.6V voltages, which can meet the design requirements of low-power compact mobile devices including mobile phones.

Performance parameters:

Status: MP

Voltage: 1.65V to 2.0V

Capacity: 128Mb

Temperature (industrial) : -40℃ to 85℃ -40℃ to 105℃ - 40 ℃ ~ 125 ℃

I/O bus: Single I/O; Dual I/O; Quad I/O; QPI

Frequency (MHz) : 133(x1 x2 x4) 104(x4 DTR)

Main features: H/W RESET; WP#;" Security Registers with OTP Locks; Suspend;" Unique ID; HOLD#

Packaging: FO-USON8 3x3mm; SOP8 208mil; USON8 4x4mm; WSON8 6x5mm; WSON8 8x6mm;

WLCSP (4-4 ball array); VSOP8 208mil