Gigadevice's WLCSP package is compact in size, enabling designers to maximize the utilization of PCB space. WLCSP packaging is the smallest size packaging method, the same as the chip size. This packaged product is powered by 1.2V,1.8V and 1.65V to 3.6V voltages, which can meet the design requirements of low-power compact mobile devices including mobile phones.

Performance parameters:

Status :MP

Voltage :1.65V to 3.6V

Capacity :4Mb

Temperature (industrial):-40℃ to 85℃ - 40 ℃ ~ 105 ℃; - 40 ℃ ~ 125 ℃

I/O bus :Single I/O; Dual I/O; Quad I/O

Frequency (MHz):104(x1 x2 x4)

Main features :S/W RESET; WP#; Security Registers with OTP Locks; Suspend; Unique ID; HOLD#

Package :SOP8 150mil; WLCSP (4x6 ball array); USON8 1.5x1.5mm; USON8 3x2mm