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GigaDevice GD5F1GM9RE Datesheet

The GigaDevice GD5F1GM9RE is a 1Gb (128MB) SPI NAND Flash memory designed for reliable, high-speed non-volatile storage in embedded systems. It supports a Serial Peripheral Interface (SPI) for simplified integration and efficient data transfer. With fast read/write performance, low power consumption, and high endurance, this device is suitable for industrial control, consumer electronics, networking equipment, and IoT applications requiring durable and compact memory solutions.

New Generation 24nm SLC NAND Flash:

Gigadevice's 24nm process SLC NAND products have core capacities of 1Gb, 2Gb, 4Gb, and 8Gb, and offer two systems: traditional parallel interfaces and the new SPI serial interface,It has been successfully mass-produced. In response to the problems that may be encountered during the operation of NAND Flash, GigaDevice manages, detects and corrects them by adopting the 8-bit ECC algorithm,Wrong, providing high performance and security features, dedicated to offering services for 5G, Internet of Things, network communication, security, and consumer application scenarios including wearable devices

A large-capacity solution with cost advantages.

◆ Supports two supply voltages: 1.8V and 3V

◆ Support random reading of 2K-Byte/4K-Byte Cache space

The programming/erasing cycle reaches 80,000 times, and the data retention time is 10 years

The Parallel NAND interface supports x8 and is compatible with ONFI1.0

The SPI NAND interface supports x1/x2/x4/x4 DTR

◆ SPI NAND additionally supports Internal ECC, Continuous Read

Functions such as Deep Power Down

◆ Supports industrial grade/automotive grade -40℃ to 85℃/-40℃ to 105℃

Performance parameters:

Status :S

Voltage :1.7V to 2.0V

Capacity :1Gb

I/O bus :x1; x2; x4

Frequency :133MHz

Page size :2KB

ECC requirement :ECC-free

Main features :DTR; Deep Power Down; Continues Read; Bad Block Management

Package :WSON8 8x6mm; WSON8 6x5mm; TFBGA24 8x6mm (5x5 ball array)

Temperature :-40℃ to 85℃ - 40 ℃ ~ 105 ℃


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